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Barrel type plasma processing equipment Product List

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Barrel-type plasma treatment device PB series

Utilizing isotropic plasma, ideal for cleaning and modifying fine patterns and the inner surfaces of tube shapes!

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oils (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating the effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical treatment chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safety specifications suitable for use as a mass production device For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

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No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

Cleaning and modification of fine patterns and the inner surfaces of tube shapes are possible! Cleaning and modification can be done without using solutions, achieving good environmental performance and low running costs.

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oil (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical processing chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safe specifications suitable for mass production equipment For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment

Added to bookmarks

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Free membership registration